MPPM8070 DC/DC Adjustable Buck Converter Module （ Input 4.5V–18V, Output 0.6V-15V ）

Features

• 2A Output Current

• Wide input voltage range ：4.5V-18V（20V maximum）

• Output voltage ：0.6V-15V

  (adjustable or fixed output versions)

• Switching frequency ：750kHz

• Efficiency of up to 93%

• Ripple of 20mV or less

• Soft start

• Good heat dissipation performance

• Small size, thin thickness, surface mount packaging method：

  LGA (8.00mm×7.00mm × 4.32(2.50mm))

       (The standard height of the product is 4.32mm, and it can reach a minimum of 2.50mm）

Applications

• Solid state drive

• Distributed power converter

• Industrial equipment power supply

• Transformer power supply

Description 

The MPPM8070 is an integrated 2A, DC/DC buck converter module. The MPPM8070 features an extremely wide input and output voltage range, with an input voltage range of 4.5V to 18V and an output voltage range of 0.6V to 15V. It boasts an efficiency of up to 93%, ripple control within 20mV, and a switching frequency of 750kHz. The MPPM8070 integrates IC chips, inductors, resistors, capacitors, and other components, allowing for plug-and-play functionality. The peripheral setup merely requires a small amount of input and output filter capacitors, as well as voltage regulation resistors (note that the fixed output version does not require external voltage regulation resistors). This ensures high reliability and significantly reduces the new product development cycle for our customers. The MPPM8070 is enclosed in a heat-dissipating, compact molded package with a small footprint. The module adopts an LGA package, measuring 8.00mm × 7.00mm × 4.32mm (2.50mm in height), making it ideal for SMT automatic assembly.

Typical Applications

2A DC/DC Buck Converter Module

Note:①For the adjustable out put voltage version, connect the Rtrim pin to a voltage-regulating resistor with an accuracy of 1% or better , grounding (GND) the other end.

②For the fixed output voltage version , this pin should be left unconnected(floating).

Efficiency@Vout=5V

Vout=5V Efficiency vs Output current

Pin Configuration

Electrical Characteristics

Performance Curve

OPeration

The MPPM8070 is a standalone, non-isolated buck switching DC/DC power supply with an input range of 4.5V to 18V, capable of delivering an output current of up to 2A. This power module offers ultra-high conversion efficiency and allows for precise adjustment of the output voltage from 0.6V to 15V. Given that the MPPM8070 is a buck converter, please ensure that the input voltage is sufficiently high to support the desired output voltage and load current.

Selection of Input Capacitor

The recommended input capacitor is a ceramic capacitor with specifications of 22μF, 25V, 0805 footprint, and X5R grade or better. Ceramic capacitors are known for their small size, high reliability, and extremely low ESR. X5R and X7R types of ceramic capacitors maintain stable performance across a wide range of temperatures and voltages, effectively minimizing the ripple in the input voltage.

Selection of Output Capacitor

The choice of the output capacitor should be based on the output voltage:

1.When the output voltage is less than 5V, a ceramic capacitor with specifications of 47μF, 6.3V, 0805 footprint, and X5R grade or higher is recommended.

2.For an output voltage ranging from 5V to 10V, a ceramic capacitor featuring 22μF, 25V, 0805 footprint, and X5R grade or higher is advisable.

3.When the output voltage exceeds 10V, it is suggested to opt for a ceramic capacitor with specifications of 10μF, 25V, 0805 footprint, and X5R grade or higher.

Selection of output capacitor and adjustment of output voltage 

(only applicable to adjustable versions)

The output voltage is determined by the voltage divider resistor of the FB pin, and the calculation formula is as follows:

The resistance of RFB is adjusted based on customer requirements, where RFB is measured in kΩ. The table below lists the recommended values for the voltage-dividing resistors at various output voltages.：

PFM mode

Under light load conditions, the MPPM8070 operates in PFM mode. To improve efficiency during these conditions, the switching frequency decreases as the load current diminishes, thereby minimizing switching losses. When the load intensifies, the switching frequency increases, leading to a reduction in ripple.

Overcurrent Protection

When the output current exceeds 2.7A, the module triggers hiccup overcurrent protection.

Input undervoltage protection 

When the input voltage falls below a preset value, the EN voltage triggers the input undervoltage lockout (UVLO) at 1.6V.

PCB Layout

Due to the high integration of the components required for power conversion in the MPPM8070, it alleviates and eliminates most of the challenging issues associated with PCB layout. However, minimizing electromagnetic interference remains crucial to ensure its proper operation. Despite the module's high integration, during use, it is still imperative to ensure adequate grounding and thermal dissipation, and to avoid overly casual layout arrangements. The recommended layout diagram is provided below.

Layout (Top View)

1. Position the R_FB resistor as close as possible to its respective pin.

2. Place the Cin capacitor as close as practical to the Vin and GND connections on the MPPM8070.

3. Position the Cout capacitor as close as possible to the Vout and GND connections on the MPPM8070.

4. When placing the Cin and Cout capacitors, ensure that their grounding currents flow directly adjacent to or underneath the MPPM8070.

5.Connect all GND points to the largest possible copper pour area on the top layer, avoiding any disruption in the grounding path between external components and the MPPM8070.

6.To achieve effective thermal dissipation, use vias to connect the GND copper pour area to the internal grounding plane of the circuit board, providing both a robust grounding connection and a thermal dissipation pathway to the internal plane. Since the vias are located close to the internal power handling components, the MPPM8070 can efficiently dissipate heat through these vias connected to the internal GND plane of the PCB.
The optimal number of thermal vias will depend on the PCB design specifics. For example, if the board incorporates very small vias, a greater number of thermal vias may be necessary to ensure adequate heat dissipation.

Package Description

 LGA packaging

6 feet

(8.00mm × 7.00mm × 2.50mm)

Soldering and Storage Precautions

Recommended reflow soldering curve

Note: Due to the module being larger than other SMT components, please do not place the module on the bottom side of the board during reflow soldering to prevent it from falling off.